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LED chips can be epoxy attached to aceramic base using 84-1LMISR4, for example.<ref name="e549"/>
LED chips can be epoxy attached to aceramic base using 84-1LMISR4, for example.<ref name="e549"/>
−Each LED can be interconnected using 32-micron gold wires, for example.<ref name="e549"/> The wires can be encapsulated using GE IVS4632 silicone, for example.<ref name="e549"/>
+Each LED can be interconnected using 32-micron gold wires, for example.<ref name="e549"/> The wires can be encapsulated using GE IVS4632 silicone, for example.<ref name="e549"/> However, wire bonding is not good and should be avoided if possible.
==References==
==References==
<references />
<references />