165,209
edits
Changes
Jump to navigation
Jump to search
no edit summary
Line 10:
Line 10:
−
LED chips can be epoxy attached to aceramic base using 84-1LMISR4, for example.<ref name="e549"/>
LED chips can be epoxy attached to aceramic base using 84-1LMISR4, for example.<ref name="e549"/>
−Each LED can be interconnected using two 32 micron gold wires, for example.<ref name="e549"/> The wires can be encapsulated using GE IVS4632 silicone, for example.<ref name="e549"/>
+Each LED can be interconnected using 32-micron gold wires, for example.<ref name="e549"/> The wires can be encapsulated using GE IVS4632 silicone, for example.<ref name="e549"/>
−==References==
==References==
<references />
<references />