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There will for example be a ceramic H-frame.<ref name="e549"/> It can be attached to a ceramic LED substrate which is at the base.<ref name="e549"/> The H-frame can be epoxy attached to the base using, for example, Ablestik 84-3 adhesive.<ref name="e549"/>+
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High-Volume HB LEDs |author=Donald J. Beck |Publisher=Palomar Technologies (44th International Symposium on Microelectronics)| url=https://meridian.allenpress.com/ism/article-pdf/2011/1/000117/2343484/isom-2011-ta4-paper1.pdf | access-date=2024-09-23}}</ref>
High-Volume HB LEDs |author=Donald J. Beck |Publisher=Palomar Technologies (44th International Symposium on Microelectronics)| url=https://meridian.allenpress.com/ism/article-pdf/2011/1/000117/2343484/isom-2011-ta4-paper1.pdf | access-date=2024-09-23}}</ref>
−LED chips can be epoxy attached to aceramic base using 84-1LMISR4, for example.<ref name="e549"/>
−LED chips can be epoxy attached to the ceramic base using 84-1LMISR4, for example.<ref name="e549"/>
Each LED can be interconnected using two 32 micron gold wires, for example.<ref name="e549"/> The wires can be encapsulated using GE IVS4632 silicone, for example.<ref name="e549"/>
Each LED can be interconnected using two 32 micron gold wires, for example.<ref name="e549"/> The wires can be encapsulated using GE IVS4632 silicone, for example.<ref name="e549"/>