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150 bytes added ,  06:13, 26 September 2024
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It requires the following: an [[LED chip]], a leadframe, a conductive attaching material, bonding wire, optional phosphor and epoxy.
 
It requires the following: an [[LED chip]], a leadframe, a conductive attaching material, bonding wire, optional phosphor and epoxy.
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There are three parts to making an LED in general: 1. Making an LED chip. 2. Mounting the LED chip to a leadframe. and 3. epoxying the LED.
    
A high brightness LED will require a heatsink.
 
A high brightness LED will require a heatsink.
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Each LED can be interconnected using 32-micron gold wires, for example.<ref name="e549"/> The wires can be encapsulated using GE IVS4632 silicone, for example.<ref name="e549"/> However, wire bonding is not good and should be avoided if possible.
 
Each LED can be interconnected using 32-micron gold wires, for example.<ref name="e549"/> The wires can be encapsulated using GE IVS4632 silicone, for example.<ref name="e549"/> However, wire bonding is not good and should be avoided if possible.
 
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__NOTOC__
 
==Packaging==
 
==Packaging==
  

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