165,209
edits
Changes
no edit summary
Line 7:
Line 7:
A major step is component attach, also known as die attach. A conductive silver paste can be used.<ref name="e549">{{cite web | title=Automated Precision Assembly for
A major step is component attach, also known as die attach. A conductive silver paste can be used.<ref name="e549">{{cite web | title=Automated Precision Assembly for
High-Volume HB LEDs |author=Donald J. Beck |Publisher=Palomar Technologies (44th International Symposium on Microelectronics)| url=https://meridian.allenpress.com/ism/article-pdf/2011/1/000117/2343484/isom-2011-ta4-paper1.pdf | access-date=2024-09-23}}</ref>
High-Volume HB LEDs |author=Donald J. Beck |Publisher=Palomar Technologies (44th International Symposium on Microelectronics)| url=https://meridian.allenpress.com/ism/article-pdf/2011/1/000117/2343484/isom-2011-ta4-paper1.pdf | access-date=2024-09-23}}</ref>
+
+There will for example be a ceramic H-frame.<ref name="e549"/> It can be attached to a ceramic LED substrate which is at the base.<ref name="e549"/> The H-frame can be epoxy attached to the base using, for example, Ablestik 84-3 adhesive.<ref name="e549"/>
+
+LED chips can be epoxy attached to the ceramic base using 84-1LMISR4, for example.<ref name="e549"/>
+
+Each LED can be interconnected using two 32 micron gold wires, for example.<ref name="e549"/> The wires can be encapsulated using GE IVS4632 silicone, for example.<ref name="e549"/>
+
+
==References==
==References==
<references />
<references />