Difference between revisions of "How to assemble an LED"

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Each LED can be interconnected using 32-micron gold wires, for example.<ref name="e549"/> The wires can be encapsulated using GE IVS4632 silicone, for example.<ref name="e549"/> However, wire bonding is not good and should be avoided if possible.
 
Each LED can be interconnected using 32-micron gold wires, for example.<ref name="e549"/> The wires can be encapsulated using GE IVS4632 silicone, for example.<ref name="e549"/> However, wire bonding is not good and should be avoided if possible.
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 +
==Packaging==
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 +
Packaging - [[LED packaging]]
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 +
==Processes==
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* Leadframe packaging
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* LED epoxy encapsulation dispensing and forming
 +
* Silver spot plating for lead frames
 +
 +
==Suppliers==
 +
* Wieland rolled products - for through hole LED leadframe stock
  
 
==References==
 
==References==
 
<references />
 
<references />

Revision as of 02:57, 23 September 2024

This is a guide on how to assemble an LED.

It requires the following: an LED chip, a leadframe, a conductive attaching material, bonding wire, optional phosphor and epoxy.

A high brightness LED will require a heatsink.

A major step is component attach, also known as die attach. A conductive silver paste can be used.[1]

LED chips can be epoxy attached to aceramic base using 84-1LMISR4, for example.[1]

Each LED can be interconnected using 32-micron gold wires, for example.[1] The wires can be encapsulated using GE IVS4632 silicone, for example.[1] However, wire bonding is not good and should be avoided if possible.

Packaging

Packaging - LED packaging

Processes

  • Leadframe packaging
  • LED epoxy encapsulation dispensing and forming
  • Silver spot plating for lead frames

Suppliers

  • Wieland rolled products - for through hole LED leadframe stock

References