Difference between revisions of "How to assemble an LED"
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LED chips can be epoxy attached to aceramic base using 84-1LMISR4, for example.<ref name="e549"/> | LED chips can be epoxy attached to aceramic base using 84-1LMISR4, for example.<ref name="e549"/> | ||
| − | Each LED can be interconnected using | + | Each LED can be interconnected using 32-micron gold wires, for example.<ref name="e549"/> The wires can be encapsulated using GE IVS4632 silicone, for example.<ref name="e549"/> |
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==References== | ==References== | ||
<references /> | <references /> | ||
Revision as of 02:53, 23 September 2024
This is a guide on how to assemble an LED.
It requires the following: an LED chip, a leadframe, a conductive attaching material, bonding wire, optional phosphor and epoxy.
A high brightness LED will require a heatsink.
A major step is component attach, also known as die attach. A conductive silver paste can be used.[1]
LED chips can be epoxy attached to aceramic base using 84-1LMISR4, for example.[1]
Each LED can be interconnected using 32-micron gold wires, for example.[1] The wires can be encapsulated using GE IVS4632 silicone, for example.[1]
References
- ↑ Jump up to: 1.0 1.1 1.2 1.3 Donald J. Beck. [https://meridian.allenpress.com/ism/article-pdf/2011/1/000117/2343484/isom-2011-ta4-paper1.pdf "Automated Precision Assembly for High-Volume HB LEDs"]. https://meridian.allenpress.com/ism/article-pdf/2011/1/000117/2343484/isom-2011-ta4-paper1.pdf.