Difference between revisions of "How to assemble an LED"

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LED chips can be epoxy attached to aceramic base using 84-1LMISR4, for example.<ref name="e549"/>
 
LED chips can be epoxy attached to aceramic base using 84-1LMISR4, for example.<ref name="e549"/>
  
Each LED can be interconnected using two 32 micron gold wires, for example.<ref name="e549"/> The wires can be encapsulated using GE IVS4632 silicone, for example.<ref name="e549"/>
+
Each LED can be interconnected using 32-micron gold wires, for example.<ref name="e549"/> The wires can be encapsulated using GE IVS4632 silicone, for example.<ref name="e549"/>
 
 
 
 
  
 
==References==
 
==References==
 
<references />
 
<references />

Revision as of 02:53, 23 September 2024

This is a guide on how to assemble an LED.

It requires the following: an LED chip, a leadframe, a conductive attaching material, bonding wire, optional phosphor and epoxy.

A high brightness LED will require a heatsink.

A major step is component attach, also known as die attach. A conductive silver paste can be used.[1]

LED chips can be epoxy attached to aceramic base using 84-1LMISR4, for example.[1]

Each LED can be interconnected using 32-micron gold wires, for example.[1] The wires can be encapsulated using GE IVS4632 silicone, for example.[1]

References