Difference between revisions of "How to assemble an LED"
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A major step is component attach, also known as die attach. A conductive silver paste can be used.<ref name="e549">{{cite web | title=Automated Precision Assembly for | A major step is component attach, also known as die attach. A conductive silver paste can be used.<ref name="e549">{{cite web | title=Automated Precision Assembly for | ||
High-Volume HB LEDs |author=Donald J. Beck |Publisher=Palomar Technologies (44th International Symposium on Microelectronics)| url=https://meridian.allenpress.com/ism/article-pdf/2011/1/000117/2343484/isom-2011-ta4-paper1.pdf | access-date=2024-09-23}}</ref> | High-Volume HB LEDs |author=Donald J. Beck |Publisher=Palomar Technologies (44th International Symposium on Microelectronics)| url=https://meridian.allenpress.com/ism/article-pdf/2011/1/000117/2343484/isom-2011-ta4-paper1.pdf | access-date=2024-09-23}}</ref> | ||
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| + | There will for example be a ceramic H-frame.<ref name="e549"/> It can be attached to a ceramic LED substrate which is at the base.<ref name="e549"/> The H-frame can be epoxy attached to the base using, for example, Ablestik 84-3 adhesive.<ref name="e549"/> | ||
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| + | LED chips can be epoxy attached to the ceramic base using 84-1LMISR4, for example.<ref name="e549"/> | ||
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| + | Each LED can be interconnected using two 32 micron gold wires, for example.<ref name="e549"/> The wires can be encapsulated using GE IVS4632 silicone, for example.<ref name="e549"/> | ||
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==References== | ==References== | ||
<references /> | <references /> | ||
Revision as of 02:46, 23 September 2024
This is a guide on how to assemble an LED.
It requires the following: an LED chip, a leadframe, a conductive attaching material, bonding wire, optional phosphor and epoxy.
A high brightness LED will require a heatsink.
A major step is component attach, also known as die attach. A conductive silver paste can be used.[1]
There will for example be a ceramic H-frame.[1] It can be attached to a ceramic LED substrate which is at the base.[1] The H-frame can be epoxy attached to the base using, for example, Ablestik 84-3 adhesive.[1]
LED chips can be epoxy attached to the ceramic base using 84-1LMISR4, for example.[1]
Each LED can be interconnected using two 32 micron gold wires, for example.[1] The wires can be encapsulated using GE IVS4632 silicone, for example.[1]
References
- ↑ Jump up to: 1.0 1.1 1.2 1.3 1.4 1.5 1.6 Donald J. Beck. [https://meridian.allenpress.com/ism/article-pdf/2011/1/000117/2343484/isom-2011-ta4-paper1.pdf "Automated Precision Assembly for High-Volume HB LEDs"]. https://meridian.allenpress.com/ism/article-pdf/2011/1/000117/2343484/isom-2011-ta4-paper1.pdf.