Difference between revisions of "How to assemble an LED"
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This is a guide on how to assemble an LED. | This is a guide on how to assemble an LED. | ||
| − | It requires an [[LED chip]], a leadframe, a conductive attaching material, bonding wire, optional phosphor and epoxy. | + | It requires the following: an [[LED chip]], a leadframe, a conductive attaching material, bonding wire, optional phosphor and epoxy. |
A high brightness LED will require a heatsink. | A high brightness LED will require a heatsink. | ||
Revision as of 02:41, 23 September 2024
This is a guide on how to assemble an LED.
It requires the following: an LED chip, a leadframe, a conductive attaching material, bonding wire, optional phosphor and epoxy.
A high brightness LED will require a heatsink.
A major step is component attach, also known as die attach. A conductive silver paste can be used.[1]
References
- ↑ Donald J. Beck. [https://meridian.allenpress.com/ism/article-pdf/2011/1/000117/2343484/isom-2011-ta4-paper1.pdf "Automated Precision Assembly for High-Volume HB LEDs"]. https://meridian.allenpress.com/ism/article-pdf/2011/1/000117/2343484/isom-2011-ta4-paper1.pdf.