Difference between revisions of "How to assemble an LED"
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(Created page with "This is a guide on how to assemble an LED. It requires an LED chip, a leadframe, a conductive attaching material, bonding wire, optional phosphor and epoxy. A high brigh...") |
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A high brightness LED will require a heatsink. | A high brightness LED will require a heatsink. | ||
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| + | A major step is component attach, also known as die attach. A conductive silver paste can be used.<ref name="e549">{{cite web | title=Automated Precision Assembly for | ||
| + | High-Volume HB LEDs |author=Donald J. Beck |Publisher=Palomar Technologies (44th International Symposium on Microelectronics)| url=https://meridian.allenpress.com/ism/article-pdf/2011/1/000117/2343484/isom-2011-ta4-paper1.pdf | access-date=2024-09-23}}</ref> | ||
==References== | ==References== | ||
<references /> | <references /> | ||
Revision as of 02:37, 23 September 2024
This is a guide on how to assemble an LED.
It requires an LED chip, a leadframe, a conductive attaching material, bonding wire, optional phosphor and epoxy.
A high brightness LED will require a heatsink.
A major step is component attach, also known as die attach. A conductive silver paste can be used.[1]
References
- ↑ Donald J. Beck. [https://meridian.allenpress.com/ism/article-pdf/2011/1/000117/2343484/isom-2011-ta4-paper1.pdf "Automated Precision Assembly for High-Volume HB LEDs"]. https://meridian.allenpress.com/ism/article-pdf/2011/1/000117/2343484/isom-2011-ta4-paper1.pdf.