Difference between revisions of "How to assemble an LED"

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High-Volume HB LEDs |author=Donald J. Beck |Publisher=Palomar Technologies (44th International Symposium on Microelectronics)| url=https://meridian.allenpress.com/ism/article-pdf/2011/1/000117/2343484/isom-2011-ta4-paper1.pdf | access-date=2024-09-23}}</ref>
 
High-Volume HB LEDs |author=Donald J. Beck |Publisher=Palomar Technologies (44th International Symposium on Microelectronics)| url=https://meridian.allenpress.com/ism/article-pdf/2011/1/000117/2343484/isom-2011-ta4-paper1.pdf | access-date=2024-09-23}}</ref>
  
There will for example be a ceramic H-frame.<ref name="e549"/> It can be attached to a ceramic LED substrate which is at the base.<ref name="e549"/> The H-frame can be epoxy attached to the base using, for example, Ablestik 84-3 adhesive.<ref name="e549"/>
+
LED chips can be epoxy attached to aceramic base using 84-1LMISR4, for example.<ref name="e549"/>
 
 
LED chips can be epoxy attached to the ceramic base using 84-1LMISR4, for example.<ref name="e549"/>
 
  
 
Each LED can be interconnected using two 32 micron gold wires, for example.<ref name="e549"/> The wires can be encapsulated using GE IVS4632 silicone, for example.<ref name="e549"/>
 
Each LED can be interconnected using two 32 micron gold wires, for example.<ref name="e549"/> The wires can be encapsulated using GE IVS4632 silicone, for example.<ref name="e549"/>

Revision as of 02:48, 23 September 2024

This is a guide on how to assemble an LED.

It requires the following: an LED chip, a leadframe, a conductive attaching material, bonding wire, optional phosphor and epoxy.

A high brightness LED will require a heatsink.

A major step is component attach, also known as die attach. A conductive silver paste can be used.[1]

LED chips can be epoxy attached to aceramic base using 84-1LMISR4, for example.[1]

Each LED can be interconnected using two 32 micron gold wires, for example.[1] The wires can be encapsulated using GE IVS4632 silicone, for example.[1]


References