Difference between revisions of "How to assemble an LED"
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It requires the following: an [[LED chip]], a leadframe, a conductive attaching material, bonding wire, optional phosphor and epoxy. | It requires the following: an [[LED chip]], a leadframe, a conductive attaching material, bonding wire, optional phosphor and epoxy. | ||
| + | |||
| + | There are three parts to making an LED in general: 1. Making an LED chip. 2. Mounting the LED chip to a leadframe. and 3. epoxying the LED. | ||
A high brightness LED will require a heatsink. | A high brightness LED will require a heatsink. | ||
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LED chips can be epoxy attached to aceramic base using 84-1LMISR4, for example.<ref name="e549"/> | LED chips can be epoxy attached to aceramic base using 84-1LMISR4, for example.<ref name="e549"/> | ||
| − | Each LED can be interconnected using | + | Each LED can be interconnected using 32-micron gold wires, for example.<ref name="e549"/> The wires can be encapsulated using GE IVS4632 silicone, for example.<ref name="e549"/> However, wire bonding is not good and should be avoided if possible. |
| + | __NOTOC__ | ||
| + | ==Packaging== | ||
| + | Packaging - [[LED packaging]] | ||
| + | ==Processes== | ||
| + | * Leadframe packaging | ||
| + | * LED epoxy encapsulation dispensing and forming | ||
| + | * Silver spot plating for lead frames | ||
| + | |||
| + | ==Suppliers== | ||
| + | * Wieland rolled products - for through-hole LED leadframe stock | ||
==References== | ==References== | ||
<references /> | <references /> | ||
| + | |||
| + | [[Category:Manufacturing]] | ||
Latest revision as of 16:19, 9 February 2025
This is a guide on how to assemble an LED.
It requires the following: an LED chip, a leadframe, a conductive attaching material, bonding wire, optional phosphor and epoxy.
There are three parts to making an LED in general: 1. Making an LED chip. 2. Mounting the LED chip to a leadframe. and 3. epoxying the LED.
A high brightness LED will require a heatsink.
A major step is component attach, also known as die attach. A conductive silver paste can be used.[1]
LED chips can be epoxy attached to aceramic base using 84-1LMISR4, for example.[1]
Each LED can be interconnected using 32-micron gold wires, for example.[1] The wires can be encapsulated using GE IVS4632 silicone, for example.[1] However, wire bonding is not good and should be avoided if possible.
Packaging[edit]
Packaging - LED packaging
Processes[edit]
- Leadframe packaging
- LED epoxy encapsulation dispensing and forming
- Silver spot plating for lead frames
Suppliers[edit]
- Wieland rolled products - for through-hole LED leadframe stock
References[edit]
- ↑ Jump up to: 1.0 1.1 1.2 1.3 Donald J. Beck. [https://meridian.allenpress.com/ism/article-pdf/2011/1/000117/2343484/isom-2011-ta4-paper1.pdf "Automated Precision Assembly for High-Volume HB LEDs"]. https://meridian.allenpress.com/ism/article-pdf/2011/1/000117/2343484/isom-2011-ta4-paper1.pdf.